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Global Multilayer Printed-wiring Board Market Research Report 2021

Published on: Mar 2022 | From USD $3500 | Published By: QY RESEARCH JAPANESE | Number Of Pages: 133

The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027. by Application segment also provides consumption during the forecast period of 2016 to 2027. Understanding the segments helps in identifying the importance of different factors that aid the market growth.

Segment by Type
Layer 4-6
Layer 8-10
Layer 10+

Segment by Application
Consumer Electronics
Communications
Computer Related Industry
Automotive Industry
Other

By Company
Nippon Mektron
ZD Tech
TTM Technologies
Unimicron
Sumitomo Denko
Compeq
Tripod
Samsung E-M
Young Poong Group
HannStar
Ibiden
Nanya PCB
KBC PCB Group
Daeduck Group
AT&S
Fujikura
Meiko
Multek
Kinsus
Chin Poon
T.P.T.
Shinko Denski
Wus Group
Simmtech
Mflex
CMK
LG Innotek
Gold Circuit
Shennan Circuit
Ellington

Production by Region
North America
Europe
China
Japan

Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E

1 Multilayer Printed-wiring Board Market Overview
1.1 Product Overview and Scope of Multilayer Printed-wiring Board
1.2 Multilayer Printed-wiring Board Segment by Type
1.2.1 Global Multilayer Printed-wiring Board Market Size Growth Rate Analysis by Type 2021 VS 2027
1.2.2 Layer 4-6
1.2.3 Layer 8-10
1.2.4 Layer 10+
1.3 Multilayer Printed-wiring Board Segment by Application
1.3.1 Global Multilayer Printed-wiring Board Consumption Comparison by Application: 2016 VS 2021 VS 2027
1.3.2 Consumer Electronics
1.3.3 Communications
1.3.4 Computer Related Industry
1.3.5 Automotive Industry
1.3.6 Other
1.4 Global Market Growth Prospects
1.4.1 Global Multilayer Printed-wiring Board Revenue Estimates and Forecasts (2016-2027)
1.4.2 Global Multilayer Printed-wiring Board Production Capacity Estimates and Forecasts (2016-2027)
1.4.3 Global Multilayer Printed-wiring Board Production Estimates and Forecasts (2016-2027)
1.5 Global Multilayer Printed-wiring Board Market by Region
1.5.1 Global Multilayer Printed-wiring Board Market Size Estimates and Forecasts by Region: 2016 VS 2021 VS 2027
1.5.2 North America Multilayer Printed-wiring Board Estimates and Forecasts (2016-2027)
1.5.3 Europe Multilayer Printed-wiring Board Estimates and Forecasts (2016-2027)
1.5.5 China Multilayer Printed-wiring Board Estimates and Forecasts (2016-2027)
1.5.5 Japan Multilayer Printed-wiring Board Estimates and Forecasts (2016-2027)

2 Market Competition by Manufacturers
2.1 Global Multilayer Printed-wiring Board Production Capacity Market Share by Manufacturers (2016-2021)
2.2 Global Multilayer Printed-wiring Board Revenue Market Share by Manufacturers (2016-2021)
2.3 Multilayer Printed-wiring Board Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.4 Global Multilayer Printed-wiring Board Average Price by Manufacturers (2016-2021)
2.5 Manufacturers Multilayer Printed-wiring Board Production Sites, Area Served, Product Types
2.6 Multilayer Printed-wiring Board Market Competitive Situation and Trends
2.6.1 Multilayer Printed-wiring Board Market Concentration Rate
2.6.2 Global 5 and 10 Largest Multilayer Printed-wiring Board Players Market Share by Revenue
2.6.3 Mergers & Acquisitions, Expansion

3 Production and Capacity by Region
3.1 Global Production Capacity of Multilayer Printed-wiring Board Market Share by Region (2016-2021)
3.2 Global Multilayer Printed-wiring Board Revenue Market Share by Region (2016-2021)
3.3 Global Multilayer Printed-wiring Board Production, Revenue, Price and Gross Margin (2016-2021)
3.4 North America Multilayer Printed-wiring Board Production
3.4.1 North America Multilayer Printed-wiring Board Production Growth Rate (2016-2021)
3.4.2 North America Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
3.5 Europe Multilayer Printed-wiring Board Production
3.5.1 Europe Multilayer Printed-wiring Board Production Growth Rate (2016-2021)
3.5.2 Europe Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
3.6 China Multilayer Printed-wiring Board Production
3.6.1 China Multilayer Printed-wiring Board Production Growth Rate (2016-2021)
3.6.2 China Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
3.7 Japan Multilayer Printed-wiring Board Production
3.7.1 Japan Multilayer Printed-wiring Board Production Growth Rate (2016-2021)
3.7.2 Japan Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)

4 Global Multilayer Printed-wiring Board Consumption by Region
4.1 Global Multilayer Printed-wiring Board Consumption by Region
4.1.1 Global Multilayer Printed-wiring Board Consumption by Region
4.1.2 Global Multilayer Printed-wiring Board Consumption Market Share by Region
4.2 North America
4.2.1 North America Multilayer Printed-wiring Board Consumption by Country
4.2.2 U.S.
4.2.3 Canada
4.3 Europe
4.3.1 Europe Multilayer Printed-wiring Board Consumption by Country
4.3.2 Germany
4.3.3 France
4.3.4 U.K.
4.3.5 Italy
4.3.6 Russia
4.4 Asia Pacific
4.4.1 Asia Pacific Multilayer Printed-wiring Board Consumption by Region
4.4.2 China
4.4.3 Japan
4.4.4 South Korea
4.4.5 Taiwan
4.4.6 Southeast Asia
4.4.7 India
4.4.8 Australia
4.5 Latin America
4.5.1 Latin America Multilayer Printed-wiring Board Consumption by Country
4.5.2 Mexico
4.5.3 Brazil

5 Production, Revenue, Price Trend by Type
5.1 Global Multilayer Printed-wiring Board Production Market Share by Type (2016-2021)
5.2 Global Multilayer Printed-wiring Board Revenue Market Share by Type (2016-2021)
5.3 Global Multilayer Printed-wiring Board Price by Type (2016-2021)

6 Consumption Analysis by Application
6.1 Global Multilayer Printed-wiring Board Consumption Market Share by Application (2016-2021)
6.2 Global Multilayer Printed-wiring Board Consumption Growth Rate by Application (2016-2021)

7 Key Companies Profiled
7.1 Nippon Mektron
7.1.1 Nippon Mektron Multilayer Printed-wiring Board Corporation Information
7.1.2 Nippon Mektron Multilayer Printed-wiring Board Product Portfolio
7.1.3 Nippon Mektron Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.1.4 Nippon Mektron Main Business and Markets Served
7.1.5 Nippon Mektron Recent Developments/Updates
7.2 ZD Tech
7.2.1 ZD Tech Multilayer Printed-wiring Board Corporation Information
7.2.2 ZD Tech Multilayer Printed-wiring Board Product Portfolio
7.2.3 ZD Tech Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.2.4 ZD Tech Main Business and Markets Served
7.2.5 ZD Tech Recent Developments/Updates
7.3 TTM Technologies
7.3.1 TTM Technologies Multilayer Printed-wiring Board Corporation Information
7.3.2 TTM Technologies Multilayer Printed-wiring Board Product Portfolio
7.3.3 TTM Technologies Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.3.4 TTM Technologies Main Business and Markets Served
7.3.5 TTM Technologies Recent Developments/Updates
7.4 Unimicron
7.4.1 Unimicron Multilayer Printed-wiring Board Corporation Information
7.4.2 Unimicron Multilayer Printed-wiring Board Product Portfolio
7.4.3 Unimicron Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.4.4 Unimicron Main Business and Markets Served
7.4.5 Unimicron Recent Developments/Updates
7.5 Sumitomo Denko
7.5.1 Sumitomo Denko Multilayer Printed-wiring Board Corporation Information
7.5.2 Sumitomo Denko Multilayer Printed-wiring Board Product Portfolio
7.5.3 Sumitomo Denko Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.5.4 Sumitomo Denko Main Business and Markets Served
7.5.5 Sumitomo Denko Recent Developments/Updates
7.6 Compeq
7.6.1 Compeq Multilayer Printed-wiring Board Corporation Information
7.6.2 Compeq Multilayer Printed-wiring Board Product Portfolio
7.6.3 Compeq Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.6.4 Compeq Main Business and Markets Served
7.6.5 Compeq Recent Developments/Updates
7.7 Tripod
7.7.1 Tripod Multilayer Printed-wiring Board Corporation Information
7.7.2 Tripod Multilayer Printed-wiring Board Product Portfolio
7.7.3 Tripod Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.7.4 Tripod Main Business and Markets Served
7.7.5 Tripod Recent Developments/Updates
7.8 Samsung E-M
7.8.1 Samsung E-M Multilayer Printed-wiring Board Corporation Information
7.8.2 Samsung E-M Multilayer Printed-wiring Board Product Portfolio
7.8.3 Samsung E-M Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.8.4 Samsung E-M Main Business and Markets Served
7.7.5 Samsung E-M Recent Developments/Updates
7.9 Young Poong Group
7.9.1 Young Poong Group Multilayer Printed-wiring Board Corporation Information
7.9.2 Young Poong Group Multilayer Printed-wiring Board Product Portfolio
7.9.3 Young Poong Group Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.9.4 Young Poong Group Main Business and Markets Served
7.9.5 Young Poong Group Recent Developments/Updates
7.10 HannStar
7.10.1 HannStar Multilayer Printed-wiring Board Corporation Information
7.10.2 HannStar Multilayer Printed-wiring Board Product Portfolio
7.10.3 HannStar Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.10.4 HannStar Main Business and Markets Served
7.10.5 HannStar Recent Developments/Updates
7.11 Ibiden
7.11.1 Ibiden Multilayer Printed-wiring Board Corporation Information
7.11.2 Ibiden Multilayer Printed-wiring Board Product Portfolio
7.11.3 Ibiden Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.11.4 Ibiden Main Business and Markets Served
7.11.5 Ibiden Recent Developments/Updates
7.12 Nanya PCB
7.12.1 Nanya PCB Multilayer Printed-wiring Board Corporation Information
7.12.2 Nanya PCB Multilayer Printed-wiring Board Product Portfolio
7.12.3 Nanya PCB Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.12.4 Nanya PCB Main Business and Markets Served
7.12.5 Nanya PCB Recent Developments/Updates
7.13 KBC PCB Group
7.13.1 KBC PCB Group Multilayer Printed-wiring Board Corporation Information
7.13.2 KBC PCB Group Multilayer Printed-wiring Board Product Portfolio
7.13.3 KBC PCB Group Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.13.4 KBC PCB Group Main Business and Markets Served
7.13.5 KBC PCB Group Recent Developments/Updates
7.14 Daeduck Group
7.14.1 Daeduck Group Multilayer Printed-wiring Board Corporation Information
7.14.2 Daeduck Group Multilayer Printed-wiring Board Product Portfolio
7.14.3 Daeduck Group Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.14.4 Daeduck Group Main Business and Markets Served
7.14.5 Daeduck Group Recent Developments/Updates
7.15 AT&S
7.15.1 AT&S Multilayer Printed-wiring Board Corporation Information
7.15.2 AT&S Multilayer Printed-wiring Board Product Portfolio
7.15.3 AT&S Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.15.4 AT&S Main Business and Markets Served
7.15.5 AT&S Recent Developments/Updates
7.16 Fujikura
7.16.1 Fujikura Multilayer Printed-wiring Board Corporation Information
7.16.2 Fujikura Multilayer Printed-wiring Board Product Portfolio
7.16.3 Fujikura Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.16.4 Fujikura Main Business and Markets Served
7.16.5 Fujikura Recent Developments/Updates
7.17 Meiko
7.17.1 Meiko Multilayer Printed-wiring Board Corporation Information
7.17.2 Meiko Multilayer Printed-wiring Board Product Portfolio
7.17.3 Meiko Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.17.4 Meiko Main Business and Markets Served
7.17.5 Meiko Recent Developments/Updates
7.18 Multek
7.18.1 Multek Multilayer Printed-wiring Board Corporation Information
7.18.2 Multek Multilayer Printed-wiring Board Product Portfolio
7.18.3 Multek Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.18.4 Multek Main Business and Markets Served
7.18.5 Multek Recent Developments/Updates
7.19 Kinsus
7.19.1 Kinsus Multilayer Printed-wiring Board Corporation Information
7.19.2 Kinsus Multilayer Printed-wiring Board Product Portfolio
7.19.3 Kinsus Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.19.4 Kinsus Main Business and Markets Served
7.19.5 Kinsus Recent Developments/Updates
7.20 Chin Poon
7.20.1 Chin Poon Multilayer Printed-wiring Board Corporation Information
7.20.2 Chin Poon Multilayer Printed-wiring Board Product Portfolio
7.20.3 Chin Poon Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.20.4 Chin Poon Main Business and Markets Served
7.20.5 Chin Poon Recent Developments/Updates
7.21 T.P.T.
7.21.1 T.P.T. Multilayer Printed-wiring Board Corporation Information
7.21.2 T.P.T. Multilayer Printed-wiring Board Product Portfolio
7.21.3 T.P.T. Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.21.4 T.P.T. Main Business and Markets Served
7.21.5 T.P.T. Recent Developments/Updates
7.22 Shinko Denski
7.22.1 Shinko Denski Multilayer Printed-wiring Board Corporation Information
7.22.2 Shinko Denski Multilayer Printed-wiring Board Product Portfolio
7.22.3 Shinko Denski Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.22.4 Shinko Denski Main Business and Markets Served
7.22.5 Shinko Denski Recent Developments/Updates
7.23 Wus Group
7.23.1 Wus Group Multilayer Printed-wiring Board Corporation Information
7.23.2 Wus Group Multilayer Printed-wiring Board Product Portfolio
7.23.3 Wus Group Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.23.4 Wus Group Main Business and Markets Served
7.23.5 Wus Group Recent Developments/Updates
7.24 Simmtech
7.24.1 Simmtech Multilayer Printed-wiring Board Corporation Information
7.24.2 Simmtech Multilayer Printed-wiring Board Product Portfolio
7.24.3 Simmtech Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.24.4 Simmtech Main Business and Markets Served
7.24.5 Simmtech Recent Developments/Updates
7.25 Mflex
7.25.1 Mflex Multilayer Printed-wiring Board Corporation Information
7.25.2 Mflex Multilayer Printed-wiring Board Product Portfolio
7.25.3 Mflex Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.25.4 Mflex Main Business and Markets Served
7.25.5 Mflex Recent Developments/Updates
7.26 CMK
7.26.1 CMK Multilayer Printed-wiring Board Corporation Information
7.26.2 CMK Multilayer Printed-wiring Board Product Portfolio
7.26.3 CMK Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.26.4 CMK Main Business and Markets Served
7.26.5 CMK Recent Developments/Updates
7.27 LG Innotek
7.27.1 LG Innotek Multilayer Printed-wiring Board Corporation Information
7.27.2 LG Innotek Multilayer Printed-wiring Board Product Portfolio
7.27.3 LG Innotek Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.27.4 LG Innotek Main Business and Markets Served
7.27.5 LG Innotek Recent Developments/Updates
7.28 Gold Circuit
7.28.1 Gold Circuit Multilayer Printed-wiring Board Corporation Information
7.28.2 Gold Circuit Multilayer Printed-wiring Board Product Portfolio
7.28.3 Gold Circuit Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.28.4 Gold Circuit Main Business and Markets Served
7.28.5 Gold Circuit Recent Developments/Updates
7.29 Shennan Circuit
7.29.1 Shennan Circuit Multilayer Printed-wiring Board Corporation Information
7.29.2 Shennan Circuit Multilayer Printed-wiring Board Product Portfolio
7.29.3 Shennan Circuit Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.29.4 Shennan Circuit Main Business and Markets Served
7.29.5 Shennan Circuit Recent Developments/Updates
7.30 Ellington
7.30.1 Ellington Multilayer Printed-wiring Board Corporation Information
7.30.2 Ellington Multilayer Printed-wiring Board Product Portfolio
7.30.3 Ellington Multilayer Printed-wiring Board Production Capacity, Revenue, Price and Gross Margin (2016-2021)
7.30.4 Ellington Main Business and Markets Served
7.30.5 Ellington Recent Developments/Updates

8 Multilayer Printed-wiring Board Manufacturing Cost Analysis
8.1 Multilayer Printed-wiring Board Key Raw Materials Analysis
8.1.1 Key Raw Materials
8.1.2 Key Raw Materials Price Trend
8.1.3 Key Suppliers of Raw Materials
8.2 Proportion of Manufacturing Cost Structure
8.3 Manufacturing Process Analysis of Multilayer Printed-wiring Board
8.4 Multilayer Printed-wiring Board Industrial Chain Analysis

9 Marketing Channel, Distributors and Customers
9.1 Marketing Channel
9.2 Multilayer Printed-wiring Board Distributors List
9.3 Multilayer Printed-wiring Board Customers

10 Market Dynamics
10.1 Multilayer Printed-wiring Board Industry Trends
10.2 Multilayer Printed-wiring Board Growth Drivers
10.3 Multilayer Printed-wiring Board Market Challenges
10.4 Multilayer Printed-wiring Board Market Restraints

11 Production and Supply Forecast
11.1 Global Forecasted Production of Multilayer Printed-wiring Board by Region (2022-2027)
11.2 North America Multilayer Printed-wiring Board Production, Revenue Forecast (2022-2027)
11.3 Europe Multilayer Printed-wiring Board Production, Revenue Forecast (2022-2027)
11.4 China Multilayer Printed-wiring Board Production, Revenue Forecast (2022-2027)
11.5 Japan Multilayer Printed-wiring Board Production, Revenue Forecast (2022-2027)

12 Consumption and Demand Forecast
12.1 Global Forecasted Demand Analysis of Multilayer Printed-wiring Board
12.2 North America Forecasted Consumption of Multilayer Printed-wiring Board by Country
12.3 Europe Market Forecasted Consumption of Multilayer Printed-wiring Board by Country
12.4 Asia Pacific Market Forecasted Consumption of Multilayer Printed-wiring Board by Region
12.5 Latin America Forecasted Consumption of Multilayer Printed-wiring Board by Country
13 Forecast by Type and by Application (2022-2027)
13.1 Global Production, Revenue and Price Forecast by Type (2022-2027)
13.1.1 Global Forecasted Production of Multilayer Printed-wiring Board by Type (2022-2027)
13.1.2 Global Forecasted Revenue of Multilayer Printed-wiring Board by Type (2022-2027)
13.1.3 Global Forecasted Price of Multilayer Printed-wiring Board by Type (2022-2027)
13.2 Global Forecasted Consumption of Multilayer Printed-wiring Board by Application (2022-2027)
14 Research Finding and Conclusion

15 Methodology and Data Source
15.1 Methodology/Research Approach
15.1.1 Research Programs/Design
15.1.2 Market Size Estimation
15.1.3 Market Breakdown and Data Triangulation
15.2 Data Source
15.2.1 Secondary Sources
15.2.2 Primary Sources
15.3 Author List
15.4 Disclaimer

SECONDARY RESEARCH
Secondary Research Information is collected from a number of publicly available as well as paid databases. Public sources involve publications by different associations and governments, annual reports and statements of companies, white papers and research publications by recognized industry experts and renowned academia etc. Paid data sources include third party authentic industry databases.

PRIMARY RESEARCH
Once data collection is done through secondary research, primary interviews are conducted with different stakeholders across the value chain like manufacturers, distributors, ingredient/input suppliers, end customers and other key opinion leaders of the industry. Primary research is used both to validate the data points obtained from secondary research and to fill in the data gaps after secondary research.

MARKET ENGINEERING
The market engineering phase involves analyzing the data collected, market breakdown and forecasting. Macroeconomic indicators and bottom-up and top-down approaches are used to arrive at a complete set of data points that give way to valuable qualitative and quantitative insights. Each data point is verified by the process of data triangulation to validate the numbers and arrive at close estimates.

EXPERT VALIDATION
The market engineered data is verified and validated by a number of experts, both in-house and external.

REPORT WRITING/ PRESENTATION
After the data is curated by the mentioned highly sophisticated process, the analysts begin to write the report. Garnering insights from data and forecasts, insights are drawn to visualize the entire ecosystem in a single report.

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