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High Bandwidth Memory Market - Growth, Trends, Forecasts (2020 - 2025)

Published on: Jun 2020 | From USD $4250 | Published By: MORDOR INTELLIGENCE | Number Of Pages: 120

The high bandwidth memory market is expected to register a CAGR of 33.5% during the forecast period (2020-2025). Major factors driving the growth of the high bandwidth memory (HBM) market include growing need for high-bandwidth, low power consumption, and highly scalable memories, increasing adoption of artificial intelligence, and a rising trend of miniaturization of electronic devices.
- With the growing application of graphics, the appetite for the fast delivery of information (bandwidth) has also increased. Therefore HBM memory performs better than a GDDR5, which was used earlier in terms of performance and power efficiency, resulting in growth opportunities for the high bandwidth memory market.
- For instance, AMD provides high bandwidth memory that uses vertically stacked memory chips interconnected by microscopic wires called through-silicon vias or TSVs. These break the processing bottleneck due to its benefits, such as 94% less space compared to GDDR5, lower power consumption, lightweight, and higher performance in terms of processing speed. The above factors increase their industry-wide applications.
- Lack of stability under extreme environmental conditions is restraining the market. Extreme environmental conditions significantly impact it in terms of the durability and reliability of memory devices. For instance, the more thermal stress a memory device is exposed to, the more of a risk there is of damaging it, which challenges a market to grow.
- In addition to the human cost of life, the impact of the spread of the COVID-19 virus on the global economy is only beginning to be appreciated. It has profound implications for the world’s technology supply chain. In the short term, there will be lower demand, but in the long run, the demand for high bandwidth memory market will increase due to emerging technologies, like 5G, the Internet of Things, high-performance computing, and the intelligent edge.

Key Market Trends

Accelerated Processing Units to Have the Largest Growth

- APUs integrate both GPU and CPU capabilities on a single SoC. This improves the overall energy efficiency of the APUs by eliminating connections between chips as well as the processing speed due to the improved data transfer rate, and thus, boosts the growth of the market due to increased applicability in various industries.
- AMD (US), the leading manufacturer of APUs, demonstrated an APU with integrated HBM and stacked non-volatile memory cells. This will also serve to drive the adoption of APUs in computing applications.
- The wide application of high bandwidth memory technology in supercomputers, robotics, and gaming open significant opportunities for the industry in many developed as well as emerging economies. For instance, NVIDIA powers US-based Summit, the world’s fastest supercomputer, as well as the fastest systems in Europe and Japan. More than 130 supercomputers on the TOP500 list are accelerated by NVIDIA, including five of the top 10.
- However, thermal issues caused by the high level of integration and high initial cost are the key restraining factor for market growth.

North America to Hold the Largest Share in the Market

- The high adoption of HBM memories in North America is primarily due to the growth in high-performance computing (HPC) applications that require high-bandwidth memory solutions for fast data processing. The demand for HPC in North America is growing due to the increasing market for AI, machine learning, and cloud computing.
- The rapidly changing technologies and high data generation, across the industries, are creating a need for more efficient processing systems. These are also some of the factors driving the demand for high bandwidth memory market in the region.
- Additionally, the US government has started the Data Center Optimization Initiative (DCOI) to deliver better services to the public while increasing return-on-investment to taxpayers, by consolidating many data centers in the country. The consolidation process includes the process for building hyper-scale data centers and to shut-off the underperforming ones. To date, the government has closed over 3,215 data centers in the country.
- Moreover, the memory manufacturing companies in North America are seeking opportunities for production expansions. For instance, Intel has already started the phases of its new fabrication plant in Arizona for manufacturing next-generation memory and storage solutions. For this project, the company spent USD 1 billion as the first phase of investment out of the total cost of USD 7 billion. Investments such as these will boost the growth of HBM in the region.

Competitive Landscape

The high bandwidth memory market is highly fragmented as the market is highly competitive and consists of several major players. The competitive rivalry in this industry is primarily dependent on the sustainable competitive advantage through innovation, levels of market penetration, and power of competitive strategy. Since the market is capital intensive, the barriers to exit are high as well. Some of the key players in the market are Intel Corporation, Toshiba Corporation, Fujitsu Ltd, etc. Some of the key recent developments in the market are -

- November 2019 - HPE's Cray announced that it would be co-developing Fujitsu's A64FX CPU to meet the requirements of likely customers such as universities and national research laboratories. As part of this new partnership, Cray and Fujitsu will explore engineering collaboration, co-development, and joint go-to-market to meet customer demand in the supercomputing space.
- March 2019 - Samsung announced its Flashbolt HBM2E, featuring eight dies per stack, a transfer rate of 3.2 GT/s, providing a total of 16 GB and 410 GB/s per stack.

Reasons to Purchase this report:

- The market estimate (ME) sheet in Excel format
- 3 months of analyst support

1 INTRODUCTION
1.1 Study Assumptions and Market Definition
1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS
4.1 Market Overview
4.2 Industry Value Chain Analysis
4.3 Industry Attractiveness - Porter's Five Forces Analysis
4.3.1 Bargaining Power of Suppliers
4.3.2 Bargaining Power of Consumers
4.3.3 Threat of New Entrants
4.3.4 Threat of Substitutes
4.3.5 Intensity of Competitive Rivalry
4.4 Market Drivers
4.4.1 Growing Need for High-bandwidth, Low Power Consuming, and Highly Scalable Memories
4.4.2 Increasing Adoption of Artificial Intelligence
4.4.3 Rising Trend of Miniaturization of Electronic Devices
4.5 Market Restraints
4.5.1 Exorbitant costs
4.5.2 Thermal Issues Caused by High Levels of Integration
4.5.3 Design Complexities Associated with HBM
4.6 Assessment of Impact of COVID-19 on the Industry

5 MARKET SEGMENTATION
5.1 Product
5.1.1 Central Processing Unit
5.1.2 Field-programmable Gate Array
5.1.3 Graphics Processing Unit
5.1.4 Application-specific Integrated Circuit
5.1.5 Accelerated Processing Unit
5.2 Application
5.2.1 High-performance Computing (HPC)
5.2.2 Networking
5.2.3 Data Centers
5.2.4 Graphics
5.3 Geography
5.3.1 North America
5.3.1.1 United States
5.3.1.2 Canada
5.3.2 Europe
5.3.2.1 United Kingdom
5.3.2.2 Germany
5.3.2.3 France
5.3.2.4 Rest of Europe
5.3.3 Asia-Pacific
5.3.3.1 China
5.3.3.2 Taiwan
5.3.3.3 Japan
5.3.3.4 Rest of Asia-Pacific
5.3.4 Latin America
5.3.5 Middle-East and Africa

6 COMPETITIVE LANDSCAPE
6.1 Company Profiles
6.1.1 Micron Technology Inc.
6.1.2 Samsung Electronics Co. Ltd
6.1.3 SK Hynix Inc.
6.1.4 IBM Corporation
6.1.5 Advanced Micro Devices
6.1.6 Intel Corporation
6.1.7 Xilinx Inc.
6.1.8 Fujitsu Ltd
6.1.9 Nvidia Corporation
6.1.10 Open-Silicon
6.1.11 Arira Design Inc.
6.1.12 Cadence Design Systems
6.1.13 Marvell Technology Group
6.1.14 Cray Inc.
6.1.15 Rambus
6.1.16 Arm Holdings

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS

SECONDARY RESEARCH
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MARKET ENGINEERING
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